Title :
High solder joint reliability with lead free solders
Author :
Amagai, Maszuini ; Toyoda, Yoshitaka ; Tajima, Takeslu
Author_Institution :
Texas Instruments
Keywords :
Additives; Assembly; Copper; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Fasteners; Lead; Nickel; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216296
