Title :
A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications
Author :
Yau, Esther W C ; Gong, J.F. ; Hong, Benny F W ; Chan, Philip C.H.
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Circuit testing; Electronic waste; Environmentally friendly manufacturing techniques; Gold; Inspection; Lead; Printing; Reliability engineering; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216297
