Title :
Copper doped eutectic tin-lead bump for power flip chip applications
Author_Institution :
Delphi Delco Electronics Systems
Keywords :
Assembly; Circuit testing; Copper; Electromigration; Failure analysis; Fatigue; Flip chip; Gold; High temperature superconductors; Metallization;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216299
