DocumentCode

1712391

Title

Copper doped eutectic tin-lead bump for power flip chip applications

Author

Yeh, Shing

Author_Institution

Delphi Delco Electronics Systems

fYear

2003

Firstpage

338

Lastpage

345

Keywords

Assembly; Circuit testing; Copper; Electromigration; Failure analysis; Fatigue; Flip chip; Gold; High temperature superconductors; Metallization;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216299

Filename

1216299