Title :
Peel test metrology for solder joint reliability of FCBGA packages
Author :
Wang, Jinlin ; Lim, H.K. ; Lew, H.S. ; Saw, Woon Theng ; Tan, Chew Hong
Author_Institution :
Intel Corporation
Keywords :
Aging; Assembly; Condition monitoring; Copper; Gold; Metrology; Nickel; Packaging; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216301
