DocumentCode

1712450

Title

Peel test metrology for solder joint reliability of FCBGA packages

Author

Wang, Jinlin ; Lim, H.K. ; Lew, H.S. ; Saw, Woon Theng ; Tan, Chew Hong

Author_Institution

Intel Corporation

fYear

2003

Firstpage

353

Lastpage

358

Keywords

Aging; Assembly; Condition monitoring; Copper; Gold; Metrology; Nickel; Packaging; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216301

Filename

1216301