DocumentCode :
1712460
Title :
Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip hyperBGA pacuage
Author :
Xue, Jie ; Hubbard, Ken ; Li, Phillip ; Tang, Jennifer ; Poom, J. ; Brillhart, Mark ; Alcoe, Dave ; Kunz, Robert ; Mendez, David
Author_Institution :
Cisco Systems Inc.
fYear :
2003
Firstpage :
359
Lastpage :
364
Keywords :
Application specific integrated circuits; Assembly; Dielectric materials; Flip chip; Heat sinks; Laminates; Life testing; Maintenance; Manufacturing processes; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216302
Filename :
1216302
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1712460
