• DocumentCode
    1712475
  • Title

    Development of transfer molding technology for package with die active side partially exposed

  • Author

    Lee, Suk Gyu ; Ho, S.C. ; Srikanth, N.

  • fYear
    2003
  • Firstpage
    365
  • Lastpage
    372
  • Keywords
    Clamps; Costs; Materials reliability; Mechanical sensors; Optical sensors; Packaging machines; Resins; Surface contamination; Surface cracks; Transfer molding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216303
  • Filename
    1216303
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712475