Title :
Development of transfer molding technology for package with die active side partially exposed
Author :
Lee, Suk Gyu ; Ho, S.C. ; Srikanth, N.
Keywords :
Clamps; Costs; Materials reliability; Mechanical sensors; Optical sensors; Packaging machines; Resins; Surface contamination; Surface cracks; Transfer molding;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216303
