• DocumentCode
    1712495
  • Title

    A framework for integrating design automation with computer aided parametric estimating (CAPE)

  • Author

    Walter, Thomas J.

  • Author_Institution
    Lockheed Martin PRICE Syst., Mount Laurel, NJ, USA
  • Volume
    1
  • fYear
    1997
  • Firstpage
    417
  • Abstract
    This paper will identify a shortcoming in the Design-To-Cost (DTC) capability of the military/aerospace industry and propose an integrated product development environment (IPDE) solution based upon: the electronic integration of computer aided parametric estimating (CAPE) tools with computer aided engineering (CAE) tools the organizational integration of cost analysts and engineers via integrated product development teams (IPDT´s). This solution is referred to as integrated Design-To-Cost (IDTC). An IDTC toolset consisting of two mature, commercially available products (PRICE systems PRICE enterprise CAPE tool and ascent logic´s RDD-100 systems engineering tool) will be used as an example of IDTC. DARPA´s rapid prototyping of application specific signal processors (RASSP) program provided the seed funding, enabling the creation of IDTC under the guidance of Lockheed Martin´s Advanced Technology Laboratories (Camden, NJ)
  • Keywords
    CAD; aerospace industry; commerce; computer aided engineering; economics; parameter estimation; product development; CAE; CAPE; Lockheed; aerospace industry; application specific signal processors; computer aided engineering; computer aided parametric estimation; design automation; design to cost; electronic integration; integrated Design-To-Cost; integrated product development environment; military industry; rapid prototyping; seed funding; Aerospace industry; Computer aided engineering; Costs; Design automation; Design engineering; Industrial electronics; Logic; Military computing; Product development; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1997. NAECON 1997., Proceedings of the IEEE 1997 National
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    0-7803-3725-5
  • Type

    conf

  • DOI
    10.1109/NAECON.1997.618114
  • Filename
    618114