Title :
Gold bump attachment-of MEM sensor die using thermocompression bonding
Author :
Marinis, Thomas F. ; Soucy, J.W.
Author_Institution :
Draper Laboratory
Keywords :
Assembly; Bonding; Ceramics; Glass; Gold; Mechanical sensors; Packaging; Stability; Testing; Thermal sensors;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216306
