• DocumentCode
    1712606
  • Title

    Analysis of vibration signals for condition monitoring of power switching equipment using wavelet transform

  • Author

    Kang, Pengju ; Birtwhistle, David

  • Author_Institution
    Sch. of Electr. & Electron. Syst. Eng., Queensland Univ. of Technol., Brisbane, Qld., Australia
  • fYear
    1998
  • Firstpage
    437
  • Lastpage
    440
  • Abstract
    A transient vibration signal processing technique jointly utilising wavelet transforms and a neural network has been developed. A nondecimated wavelet transform is employed as the wavelet band energy feature extractor and decimated wavelet transform as the envelope feature extractor for primary vibration signals. The feature patterns prepared from the output of the two feature extractors are used to train a self-organising map (SOM) for fault detection on power switching equipment. From the present investigation, it is concluded that wavelet-based feature extractor permits the extraction of essential features from transient vibration signals. Normalised quantisation error (NQE) of SOM is introduced to quantify the deviation of a vibration signal and its template. Numerical results show that NQE can be used as an effective indicator for faults occurring in a power switching device
  • Keywords
    condition monitoring; quantisation (signal); self-organising feature maps; signal processing; switchgear testing; vibration measurement; wavelet transforms; condition monitoring; envelope feature extractor; fault detection; neural network; nondecimated wavelet transform; normalised quantisation error; power switching equipment; self-organising map; transient vibration signal processing technique; vibration signals; Condition monitoring; Discrete wavelet transforms; Feature extraction; Frequency; Resonance; Signal analysis; Signal processing; Vibrations; Wavelet analysis; Wavelet transforms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Time-Frequency and Time-Scale Analysis, 1998. Proceedings of the IEEE-SP International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • Print_ISBN
    0-7803-5073-1
  • Type

    conf

  • DOI
    10.1109/TFSA.1998.721455
  • Filename
    721455