DocumentCode
1712630
Title
A finite element modeling methodology for thermomechanical analysis of printed wiring board assemblies
Author
Ding, Hai ; Powell, Reinhard E. ; Hanna, Carl R. ; Ume, I. Charles
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
410
Lastpage
414
Keywords
Analytical models; Assembly; Computational modeling; Electronics packaging; Finite element methods; Geometry; Object oriented modeling; Solid modeling; Thermomechanical processes; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216310
Filename
1216310
Link To Document