Title :
A finite element modeling methodology for thermomechanical analysis of printed wiring board assemblies
Author :
Ding, Hai ; Powell, Reinhard E. ; Hanna, Carl R. ; Ume, I. Charles
Author_Institution :
Georgia Institute of Technology
Keywords :
Analytical models; Assembly; Computational modeling; Electronics packaging; Finite element methods; Geometry; Object oriented modeling; Solid modeling; Thermomechanical processes; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216310
