• DocumentCode
    1712655
  • Title

    Power cycling simulation of an IC package: considering electromigration and thermal-mechanical failure

  • Author

    Liu, Yong ; Irving, Scott

  • Author_Institution
    Fairchild Semiconductor Corp.
  • fYear
    2003
  • Firstpage
    415
  • Lastpage
    421
  • Keywords
    Analytical models; Current density; Electromigration; Electronic packaging thermal management; Fatigue; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device packaging; Soldering; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216311
  • Filename
    1216311
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712655