Title :
Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages
Author :
Perkins, Andy ; Sitaraman, Suresh K.
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Ceramics; Computational modeling; Electronic packaging thermal management; Electronics packaging; Joining materials; Soldering; Space technology; Temperature; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216312
