Title :
Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages
Author :
Zhang, H.Y. ; Pinjala, D. ; Joshi, Y.K. ; Wong, T.N. ; Toh, K.C.
Author_Institution :
Institute of Microelectronics
Keywords :
Assembly; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Flip chip; Fluid flow; Heat sinks; Liquid cooling; Microchannel; Power dissipation;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216313
