• DocumentCode
    1712698
  • Title

    Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

  • Author

    Zhang, H.Y. ; Pinjala, D. ; Joshi, Y.K. ; Wong, T.N. ; Toh, K.C.

  • Author_Institution
    Institute of Microelectronics
  • fYear
    2003
  • Firstpage
    431
  • Lastpage
    437
  • Keywords
    Assembly; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Flip chip; Fluid flow; Heat sinks; Liquid cooling; Microchannel; Power dissipation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216313
  • Filename
    1216313
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712698