• DocumentCode
    1712734
  • Title

    Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

  • Author

    Zhang, Zhuqing ; Voyakunpinij, A. ; Sitaraman, Suresh K. ; Wong, C.P.

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    443
  • Lastpage
    448
  • Keywords
    Costs; Curing; Delay; Materials science and technology; Packaging; Semiconductor device modeling; Soldering; Temperature distribution; Thermal stresses; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216315
  • Filename
    1216315
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712734