• DocumentCode
    1712751
  • Title

    Electronic components in cell phone handsets: thermal simulations and evaluation of modeling assumptions

  • Author

    Elie, Awad ; Ferrario, John

  • Author_Institution
    IBM Mcroelectronics
  • fYear
    2003
  • Firstpage
    449
  • Lastpage
    451
  • Keywords
    Analytical models; Cellular phones; Chip scale packaging; Computational fluid dynamics; Electronic components; Electronic packaging thermal management; Performance analysis; Telephone sets; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216316
  • Filename
    1216316
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712751