Title :
Electronic components in cell phone handsets: thermal simulations and evaluation of modeling assumptions
Author :
Elie, Awad ; Ferrario, John
Author_Institution :
IBM Mcroelectronics
Keywords :
Analytical models; Cellular phones; Chip scale packaging; Computational fluid dynamics; Electronic components; Electronic packaging thermal management; Performance analysis; Telephone sets; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216316
