DocumentCode :
1712781
Title :
Partial discharge on-line monitoring system based on FPGA
Author :
Cheng, Yonghong ; Hu, Xuesheng ; Chen, Xiaolin ; Li, Peizhun
Author_Institution :
State Key Lab. of Electr. Insulation for Power Equip., Xi´´an Jiaotong Univ., China
Volume :
2
fYear :
2005
Firstpage :
486
Abstract :
According to the demand of partial discharge on-line monitoring system, this paper puts forward a new scheme employing field programmable gate array (FPGA) instead of the general-purpose high-speed date acquisition (DAQ). Then, the reconfigurable hardware platform is designed and partial discharge algorithms based on IEC270 are provided. The form of reconfigurable structure and method for realizing the remote reconfiguration of the programmable FPGA are investigated. Using the dataflash chip, DSP can manage and store data up to 512 Mbits by serial peripheral interface (SPI) bus. At the same time, this paper discusses the results of software simulation, including data acquisition, data storage, partial discharge algorithm, and communication with DSP. At last, this paper analyzes the possibilities of applying the reconfigurable platform, FPGA-DSP, to the study of new methods for partial discharge on-line monitoring system.
Keywords :
computerised monitoring; data acquisition; digital signal processing chips; field programmable gate arrays; insulation testing; partial discharge measurement; peripheral interfaces; power apparatus; power engineering computing; DAQ; DSP; FPGA; IEC270; data storage; dataflash chip; field programmable gate array; high-speed date acquisition; partial discharge on-line monitoring system; power equipment; reconfigurable hardware platform; serial peripheral interface bus; software simulation; Data acquisition; Digital signal processing; Digital signal processing chips; Field programmable gate arrays; Memory; Monitoring; Partial discharges; Signal analysis; Signal processing algorithms; Statistical analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193595
Filename :
1496195
Link To Document :
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