Title :
Recent advances in plasma-based ion sources for commercial ion implantation of semiconductors
Author :
Horsky, T.N. ; Vanderberg, B.H.
Author_Institution :
Eaton Corp. Semicond. Equip. Oper., Beverly, MA, USA
Abstract :
Summary form only given. Commercial Ion Implanters have always used plasma sources to generate the dopant ions which form the implanter ion beam. This variable-energy beam is used to modify the electrical properties of silicon wafer substrates. We will describe some of the source technologies which have recently been developed specifically for ion implant. The standard technology in the industry is the enhanced Bernas hot cathode arc discharge source, but more recently an indirectly-heated cathode version has been developed which yields more attractive production performance and reliability. Both of these design configurations have been further customized by OEM´s, for example by implementing dual emitter configurations. The implant application of RF ion sources will also be discussed and a historical context will be established, focusing on the advantages of the relatively cold plasma provided by the RF source technology originally developed for neutral beam injection in fusion research.
Keywords :
ion implantation; ion sources; plasma devices; semiconductor device manufacture; semiconductor doping; RF ion sources; RF source technology; cold plasma; commercial ion implantation; commercial ion implanters; dopant ions; dual emitter configurations; enhanced Bernas hot cathode arc discharge source; implanter ion beam; indirectly-heated cathode; plasma-based ion sources; semiconductors; silicon wafer substrates; source technologies; variable-energy beam; Cathodes; Implants; Ion beams; Ion sources; Plasma applications; Plasma properties; Plasma sources; Radio frequency; Silicon; Standards development;
Conference_Titel :
Plasma Science, 1999. ICOPS '99. IEEE Conference Record - Abstracts. 1999 IEEE International Conference on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-5224-6
DOI :
10.1109/PLASMA.1999.829526