Title :
Educational modules on RF MEMS and microsystems
Author_Institution :
University of California
Keywords :
Educational programs; Electronics packaging; Fabrication; Gallium arsenide; Integrated circuit packaging; Micromechanical devices; Propagation losses; Radio frequency; Radiofrequency microelectromechanical systems; Seminars;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216325
