DocumentCode :
171302
Title :
DC to 6.5 GHz highly linear low-noise AlGaN/GaN traveling wave amplifier with diode predistortion
Author :
Coers, Malte ; Bosch, Wolfgang
Author_Institution :
Inst. for Microwave & Photonic Eng., Graz Univ. of Technol., Graz, Austria
fYear :
2014
fDate :
1-6 June 2014
Firstpage :
1
Lastpage :
4
Abstract :
A five-stage linear low-noise uniform traveling wave amplifier (L2NTWA) design fabricated in an AlGaN/GaN 0.25μm monolithic microwave integrated circuit (MMIC) process is presented. The amplifier exhibits a bandwidth of 10 MHz - 6.5 GHz at a constant gain of 15 dB and a minimum NF of 1.5 dB. For small-signal operation only, an on-chip active cold load (ACL) can be optionally connected by a bond-wire to replace the gate-line termination resistor and thus to improve the TWA´s low frequency noise performance. To the author´s best knowledge, for the first time a tunable diode predistortion concept is applied in a TWA to improve linearity by cancellation of the CGS dependent nonlinearity. Large-signal measurements show a SFDR of larger than 38 dBc at 25 dBm output power and a P1dB and PSAT at moderate bias of larger than 29 dBm and 33.5 dBm, respectively. The measured OIP3 is larger than 42 dBm over the full bandwidth. All measurements of the MMIC have been conducted in a custom-made PCB mountable package, including off-chip SMD low frequency extensions, to guarantee optimum electrical and thermal performance of the amplifier.
Keywords :
III-V semiconductors; MMIC amplifiers; aluminium compounds; gallium compounds; lead bonding; linearisation techniques; low noise amplifiers; microwave diodes; travelling wave amplifiers; wide band gap semiconductors; ACL; AlGaN-GaN; L2NTWA design; MMIC process; TWA low frequency noise performance; bandwidth 10 MHz to 6.5 GHz; bond-wire; custom-made PCB mountable package; five-stage linear low-noise uniform traveling wave amplifier; frequency 0 GHz to 6.5 GHz; gain 15 dB; gate-line termination resistor; large-signal measurements; linearization techniques; monolithic microwave integrated circuit; off-chip SMD low frequency extensions; on-chip active cold load; optimum electrical performance; size 0.25 mum; small-signal operation; thermal performance; tunable diode predistortion concept; Flip-chip devices; Gallium nitride; High definition video; Logic gates; Microwave FET integrated circuits; Microwave amplifiers; Microwave integrated circuits; AlGaN/GaN; MMICs; broadband amplifiers; distributed amplifiers; linearity; linearization techniques; low-noise amplifiers; noise; predistortion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location :
Tampa, FL
Type :
conf
DOI :
10.1109/MWSYM.2014.6848449
Filename :
6848449
Link To Document :
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