• DocumentCode
    1713108
  • Title

    Large die flip chip packaging on organic substrates. the role of finite element analysis (FEA), materials characterization, failure analysis (FA) and test vehicles in development spins

  • Author

    Goodelle, Jason P. ; Amin, Abmed ; Gilbert, Jeffery ; Horvath, C. ; Nease, Ed ; Vaccaro, Brian T.

  • Author_Institution
    Agere Systems
  • fYear
    2003
  • Firstpage
    524
  • Lastpage
    535
  • Keywords
    Assembly; Failure analysis; Finite element methods; Flip chip; Materials reliability; Materials testing; Optical materials; Packaging; Thermal stresses; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216331
  • Filename
    1216331
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713108