1713117

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

Jackson, G.J. ; Hendriksen, M.W. ; Durairaj, R.K. ; Ekere, N.N. ; Desmulliez, M.P.Y. ; Kay, R.W.

University of Greenwich

2003

536

543

Apertures; Costs; Flip chip; Geometry; Integrated circuit interconnections; Integrated circuit packaging; Printing; Semiconductor device manufacture; Semiconductor device packaging; Surface-mount technology;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216332

1216332