• DocumentCode
    1713117
  • Title

    Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

  • Author

    Jackson, G.J. ; Hendriksen, M.W. ; Durairaj, R.K. ; Ekere, N.N. ; Desmulliez, M.P.Y. ; Kay, R.W.

  • Author_Institution
    University of Greenwich
  • fYear
    2003
  • Firstpage
    536
  • Lastpage
    543
  • Keywords
    Apertures; Costs; Flip chip; Geometry; Integrated circuit interconnections; Integrated circuit packaging; Printing; Semiconductor device manufacture; Semiconductor device packaging; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216332
  • Filename
    1216332
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713117