Title :
Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrate
Author :
Wu, Y.P. ; Alam, M.O. ; Chan, Y.C. ; Wu, B.Y.
Author_Institution :
City University of Hong Kong
Keywords :
Adhesives; Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Conductive films; Contact resistance; Flip chip; Glass; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216333
