• DocumentCode
    1713156
  • Title

    Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrate

  • Author

    Wu, Y.P. ; Alam, M.O. ; Chan, Y.C. ; Wu, B.Y.

  • Author_Institution
    City University of Hong Kong
  • fYear
    2003
  • Firstpage
    544
  • Lastpage
    548
  • Keywords
    Adhesives; Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Conductive films; Contact resistance; Flip chip; Glass; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216333
  • Filename
    1216333
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713156