• DocumentCode
    1713229
  • Title

    Bumpless flip chip packages for cost/performance driven devices

  • Author

    Lin, Charles W C ; Chiang, Sam C L ; Yang, T. K Andrew

  • Author_Institution
    Bridge Semiconductor Corporation
  • fYear
    2003
  • Firstpage
    554
  • Lastpage
    559
  • Keywords
    Assembly; Costs; Electronics packaging; Flip chip; Integrated circuit packaging; Routing; Semiconductor device packaging; Substrates; Wafer bonding; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216335
  • Filename
    1216335
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713229