Title :
Predictive failure model of flip chip on board component level assemblies
Author :
Muncy, Jennifer ; Lazarakis, Theodore ; Baldwin, Daniel
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Bonding; Equations; Fatigue; Flip chip; Life testing; Materials testing; Predictive models; Stress; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216339
