Title :
Effect of package and board characteristics on solder joint reliability of microstar BGA
Author :
Variyam, Manjula ; Chiu, Tz-Cheng ; Sundararaman, Vish ; Edwards, Darvin
Author_Institution :
Texas Instruments, Inc.
Keywords :
Assembly; Chip scale packaging; Electronics packaging; Fatigue; Instruments; Leg; Soldering; Temperature; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216340
