• DocumentCode
    1713371
  • Title

    Effect of package and board characteristics on solder joint reliability of microstar BGA

  • Author

    Variyam, Manjula ; Chiu, Tz-Cheng ; Sundararaman, Vish ; Edwards, Darvin

  • Author_Institution
    Texas Instruments, Inc.
  • fYear
    2003
  • Firstpage
    583
  • Lastpage
    588
  • Keywords
    Assembly; Chip scale packaging; Electronics packaging; Fatigue; Instruments; Leg; Soldering; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216340
  • Filename
    1216340
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713371