Title :
Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies
Author :
Vandevelde, B. ; Gonzalez, M. ; Beyne, E. ; Zhang, G.Q. ; Caers, J.
Author_Institution :
IMEC
Keywords :
Assembly systems; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Fatigue; Shape; Soldering; Stress; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216341
