Title :
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation
Author :
Schubert, A. ; Dudek, R. ; Auerswald, E. ; Gollbardt, A. ; Michel, B. ; Reichl, H.
Author_Institution :
Fraunhofer Institute for Reliability and Microintegration
Keywords :
Assembly; Creep; Fatigue; Intermetallic; Lead; Microstructure; Packaging; Predictive models; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Conference_Location :
New Orleans, Louisiana, USA
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216343
