Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Author

Schubert, A. ; Dudek, R. ; Auerswald, E. ; Gollbardt, A. ; Michel, B. ; Reichl, H.

Author_Institution

Fraunhofer Institute for Reliability and Microintegration

fYear

2003

Firstpage

603

Lastpage

610

Keywords

Assembly; Creep; Fatigue; Intermetallic; Lead; Microstructure; Packaging; Predictive models; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

Conference_Location

New Orleans, Louisiana, USA

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216343

Filename

1216343

Link To Document