DocumentCode

1713468

Title

Damage evolution in Sn62Pb36Ag2 solder of a chip scale pacliage under a monotonic shear stress

Author

Canumalla, S. ; Mathew, S. ; Saha, S.K.

Author_Institution

Nokia Mobile Phones

fYear

2003

Firstpage

611

Lastpage

619

Keywords

Assembly; Capacitive sensors; Chip scale packaging; Creep; Resins; Stress; Surface cracks; Temperature; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216344

Filename

1216344