Title :
A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging
Author :
Premachandran, C.S. ; Nagarajan, Ranganathan ; Yu, Chen ; Xiolin, Zang ; Choong, Chong Ser
Author_Institution :
histitute of Microclectronics
Keywords :
Conducting materials; Copper; Etching; Filling; Integrated circuit interconnections; Microelectromechanical devices; Micromechanical devices; Plastic packaging; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216346
