• DocumentCode
    1713517
  • Title

    A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging

  • Author

    Premachandran, C.S. ; Nagarajan, Ranganathan ; Yu, Chen ; Xiolin, Zang ; Choong, Chong Ser

  • Author_Institution
    histitute of Microclectronics
  • fYear
    2003
  • Firstpage
    627
  • Lastpage
    630
  • Keywords
    Conducting materials; Copper; Etching; Filling; Integrated circuit interconnections; Microelectromechanical devices; Micromechanical devices; Plastic packaging; Silicon; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216346
  • Filename
    1216346
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713517