Title :
IC stacking technology using fine pitch, nanoscale through silicon vias
Author :
Spiesshoefer, S. ; Schaper, L.
Author_Institution :
University of Arkansas
Keywords :
Chemical vapor deposition; Copper; Delay; Fabrication; Image sensors; Logic; Sensor arrays; Silicon; Stacking; Titanium;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216347
