Title :
Batch fabrication of through-wafer vias in CMOS wafers for 3-D packaging applications
Author :
Rasmussen, F.E. ; Hesche, M. ; Hansen, O.
Author_Institution :
Technical University of Denmark
Keywords :
CMOS process; CMOS technology; Circuits; Etching; Fabrication; Metallization; Packaging; Plasma temperature; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216348
