High-density packaging technologies on silicon substrates

Author

Akazawa, M. ; Kuramochi, Satoru ; Nakayama, Keisuke ; Takano, Akihito ; Yamaguchi, Masaki ; Fukuoka, Yoshitaka

Author_Institution

Dai Nippon Printing Co., Ltd.

fYear

2003

Firstpage

647

Lastpage

651

Keywords

Conductors; Copper; Electronics packaging; Frequency; LAN interconnection; Plugs; Printing; Silicon; Strips; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216350

Filename

1216350

Link To Document