Title :
High-density packaging technologies on silicon substrates
Author :
Akazawa, M. ; Kuramochi, Satoru ; Nakayama, Keisuke ; Takano, Akihito ; Yamaguchi, Masaki ; Fukuoka, Yoshitaka
Author_Institution :
Dai Nippon Printing Co., Ltd.
Keywords :
Conductors; Copper; Electronics packaging; Frequency; LAN interconnection; Plugs; Printing; Silicon; Strips; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216350
