Title :
Pb-free bumping by alloying electroplated metal stacks
Author :
Ezawa, Hirokazu ; Miyata, Masahiro ; Seto, Masaharu ; Honma, Soichi
Author_Institution :
Toshiba Corporation Semiconductor Company
Keywords :
Additives; Alloying; Annealing; Calorimetry; Cooling; Intermetallic; Printing; Temperature; Tin; Ultra large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216353
