Title :
New fluxless bonding process in air using Sn-Bi with Au cap
Author :
Kim, Dongwook ; Lee, Chin C.
Author_Institution :
University of California
Keywords :
Bismuth; Bonding; Gold; Oxidation; Scanning electron microscopy; Silicon; Soldering; Spectroscopy; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216354
