• DocumentCode
    1713715
  • Title

    Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy

  • Author

    Pang, John H L ; Xiong, B.S. ; Neo, C.C. ; Mang, X.R. ; Low, T.H.

  • Author_Institution
    Nanyang Technological University
  • fYear
    2003
  • Firstpage
    673
  • Lastpage
    679
  • Keywords
    Copper; Electronics industry; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Microstructure; Soldering; Temperature; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216355
  • Filename
    1216355
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713715