Title :
Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps
Author :
Jang, Jin-Wook ; De Silva, Ananda ; Lin, Jong-Kai ; Frear, Darrel
Author_Institution :
Motorola, Semiconductor Products Sector
Keywords :
Annealing; Environmentally friendly manufacturing techniques; Flip chip; Lead compounds; Mechanical factors; Microstructure; Soldering; Solid state circuits; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216356
