Title :
A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties
Author :
Gong, Jig-Feng ; Xiao, Guo-Wei ; Chan, Philip C.H. ; Lee, Ricky S W ; Yuen, Matthew M F
Author_Institution :
The Hong Kong University of Science and Technology
Keywords :
Copper; Current density; Gold; Intermetallic; Microstructure; Packaging; Printing; Rough surfaces; Surface morphology; Surface roughness;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216357
