Title :
3D large deformation and nonlinear stress analyses of tin whisker initiation and growth on lead-free components
Author :
Lau, John H. ; Pan, Stephen H. ; Chen Xa
Author_Institution :
Agilent Technologies, Inc.
Keywords :
Boundary value problems; Chemicals; Cities and towns; Compressive stress; Copper; Electric shock; Environmentally friendly manufacturing techniques; Thermal loading; Thermal stresses; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216358
