Title :
Experimental and modeling analysis of the reliability of the anisotropic conductive films
Author :
Yin, C.Y. ; Lu, H. ; Bailey, C. ; Chan, Y.C.
Author_Institution :
The University of Greenwich
Keywords :
Anisotropic conductive films; Anisotropic magnetoresistance; Assembly; Conductive adhesives; Contact resistance; Flip chip; Polymer films; Semiconductor device modeling; Stress; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216359
