Title :
Delamination control in electronic packaging using the energy method
Author :
Fan, H.B. ; Tang, H.B. ; Yuen, Matthew M F ; Chan, Philip C.H.
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Capacitive sensors; Copper; Delamination; Electromagnetic compatibility; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216360
