DocumentCode :
1713913
Title :
Interfacial fracture analysis of underfill delamination and flip chip reliability optimization
Author :
Zhai, Charlie J. ; Sidharth ; Blish, Richard ; Master, Raj ; Parthasarathy, Srinivasan
Author_Institution :
Advanced Micro Devices, Inc
fYear :
2003
Firstpage :
714
Lastpage :
719
Keywords :
Capacitive sensors; Delamination; Electronic packaging thermal management; Electronics packaging; Flip chip; Material properties; Passivation; Temperature; Thermal expansion; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216362
Filename :
1216362
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1713913
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