• DocumentCode
    1713913
  • Title

    Interfacial fracture analysis of underfill delamination and flip chip reliability optimization

  • Author

    Zhai, Charlie J. ; Sidharth ; Blish, Richard ; Master, Raj ; Parthasarathy, Srinivasan

  • Author_Institution
    Advanced Micro Devices, Inc
  • fYear
    2003
  • Firstpage
    714
  • Lastpage
    719
  • Keywords
    Capacitive sensors; Delamination; Electronic packaging thermal management; Electronics packaging; Flip chip; Material properties; Passivation; Temperature; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216362
  • Filename
    1216362
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713913