• DocumentCode
    1713916
  • Title

    Simulation of magnetron sputter with three-dimensional magnetic field

  • Author

    Shon, C.H. ; Park, Joon S. ; Lee, Jung Keun

  • Author_Institution
    Dept. of Phys., Pohang Univ. of Sci. & Technol., South Korea
  • fYear
    1999
  • Firstpage
    243
  • Abstract
    Summary form only given. Various properties of planar magnetron system are obtained with a kinetic code (Verboncoeur et al., 1995) in a magnetic field in two dimension and three dimension. We simulate the magnetron system to obtain various plasma characteristics and erosion profiles of target material with these magnetic fields. The steady-state properties are calculated from the scaling formulas to save computing time. Various geometries and magnetic fields are used to optimize the erosion profiles and plasma characteristics. The calculated erosion profile is compared with experimental one. The maximum erosion point of calculation coincides well with the experimental one. The discrepancy of erosion width between calculation and experiment originates from the changes of electric field and magnetic field in the eroded target region. This is verified from the simulation with a pre-eroded target geometry.
  • Keywords
    electrodes; magnetic field effects; magnetrons; plasma simulation; sputtering; wear; electric field; eroded target region; erosion profiles; erosion width; geometries; kinetic code; magnetron sputter; planar magnetron system; plasma characteristics; pre-eroded target geometry; steady-state properties; three-dimensional magnetic field; Computational modeling; Geometry; Kinetic theory; Magnetic fields; Magnetic materials; Magnetic properties; Plasma materials processing; Plasma properties; Plasma simulation; Steady-state;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1999. ICOPS '99. IEEE Conference Record - Abstracts. 1999 IEEE International Conference on
  • Conference_Location
    Monterey, CA, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-5224-6
  • Type

    conf

  • DOI
    10.1109/PLASMA.1999.829565
  • Filename
    829565