Title :
Effect of packaging on interfacial cracking in Cu/ low k Damascene structures
Author :
Wang, Guotao ; Groothuis, Steven ; Ho, Paul S.
Author_Institution :
The University of Texas
Keywords :
Assembly; Capacitive sensors; Delamination; Dielectrics; Electronic packaging thermal management; Optical interferometry; Phase shifting interferometry; Strain measurement; Thermal stresses; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216364
