• DocumentCode
    1713942
  • Title

    Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

  • Author

    Wang, Guotao ; Groothuis, Steven ; Ho, Paul S.

  • Author_Institution
    The University of Texas
  • fYear
    2003
  • Firstpage
    727
  • Lastpage
    732
  • Keywords
    Assembly; Capacitive sensors; Delamination; Dielectrics; Electronic packaging thermal management; Optical interferometry; Phase shifting interferometry; Strain measurement; Thermal stresses; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216364
  • Filename
    1216364
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713942