DocumentCode

1713961

Title

Analytical solution for moisture-induced interface delamination in electronic packaging

Author

Fan, Xuejun ; Zhang, G.Q. ; van Driel, W. ; Ernst, L.J.

Author_Institution

Philips Research USA

fYear

2003

Firstpage

733

Lastpage

738

Keywords

Absorption; Delamination; Electronics packaging; Moisture; Plastics; Polymers; Printed circuits; Semiconductor device packaging; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216365

Filename

1216365