Title :
Development of a web-based course on lead free solders for electronics packaging
Author :
Liu, Johan ; Andersson, Cristina
Author_Institution :
Chalmers University of Technology
Keywords :
Assembly; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Joining materials; Lead; Mechanical factors; Microstructure; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216366
