• DocumentCode
    1713999
  • Title

    Mechanical properties of packaging materials -the need and a strategy for an educational module

  • Author

    Wiese, Steffen ; Wolter, Klaus-juergen

  • Author_Institution
    Dresden University of Technology
  • fYear
    2003
  • Firstpage
    743
  • Lastpage
    747
  • Keywords
    Assembly; Education; Electronic packaging thermal management; Electronics packaging; Flip chip; Materials science and technology; Mechanical engineering; Mechanical factors; Stress; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216367
  • Filename
    1216367
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713999