• DocumentCode
    1714043
  • Title

    Flip-chip packaging interconnect technology and reliability

  • Author

    He, Xiaolimg

  • Author_Institution
    University of Wisconsin
  • fYear
    2003
  • Firstpage
    748
  • Lastpage
    752
  • Keywords
    Chip scale packaging; Educational technology; Electronics packaging; Mechanical engineering; Mechanical systems; Microelectronics; Micromechanical devices; Semiconductor device packaging; Silicon carbide; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216368
  • Filename
    1216368
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714043