Title :
Flip-chip packaging interconnect technology and reliability
Author_Institution :
University of Wisconsin
Keywords :
Chip scale packaging; Educational technology; Electronics packaging; Mechanical engineering; Mechanical systems; Microelectronics; Micromechanical devices; Semiconductor device packaging; Silicon carbide; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216368
