DocumentCode
1714326
Title
Analysis of radiation caused by SSN and transmission line by combining the equivalent circuits of active IC into FDTD
Author
Lin, Yen-Hui ; Wu, Tzong-Lin
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
1
fYear
2004
Firstpage
277
Abstract
Simultaneous switching noise (SSN) caused by transient currents degrades the signal integrity (SI) and electromagnetic interference (EMI) performance of high-speed digital circuits (HSDC). In order to analyze these effects, an accurate full-wave modeling approach, which includes active devices and passive interconnects (including power and ground planes), is required. We link the equivalent circuit of an active IC into an FDTD algorithm by the equivalent current-source method (ECSM). The radiation behavior of the switched IC on PCB circuits can thus be investigated. It is found that two mechanisms dominate for the radiations of the switched IC. One is the GBN (ground bounce noise) radiation and the other is the signal trace radiation. The interaction between them and an elimination method is discussed.
Keywords
digital integrated circuits; electromagnetic interference; equivalent circuits; finite difference time-domain analysis; high-speed integrated circuits; integrated circuit modelling; integrated circuit noise; printed circuits; transients; EMI performance; FDTD; active IC; active devices; electromagnetic interference performance; equivalent circuits; equivalent current-source method; full-wave modeling; ground bounce noise radiation; ground plane; high-speed digital circuits; passive interconnects; power plane; signal integrity; signal trace radiation; simultaneous switching noise radiation; transient currents; transmission line; Distributed parameter circuits; Electromagnetic interference; Electromagnetic transients; Equivalent circuits; Finite difference methods; Integrated circuit noise; Power system transients; Power transmission lines; Switching circuits; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN
0-7803-8443-1
Type
conf
DOI
10.1109/ISEMC.2004.1350040
Filename
1350040
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