Title :
Microstructural and performance implications of gold in Su-Ag-Cu-Sb interconnections
Author :
Peng, Weiqun ; Dunford, Steve ; Viswanadham, Puligandla ; Quander, Stephen
Author_Institution :
Nokia Corporation
Keywords :
Assembly; Ceramics; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Microstructure; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216382
