• DocumentCode
    1714347
  • Title

    Microstructural and performance implications of gold in Su-Ag-Cu-Sb interconnections

  • Author

    Peng, Weiqun ; Dunford, Steve ; Viswanadham, Puligandla ; Quander, Stephen

  • Author_Institution
    Nokia Corporation
  • fYear
    2003
  • Firstpage
    809
  • Lastpage
    815
  • Keywords
    Assembly; Ceramics; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Microstructure; Soldering; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216382
  • Filename
    1216382
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714347