Title :
Characterization of solder joint electromigration for flip chip technology
Author :
Lin, Jong-Kai ; Jang, Jin-Wook ; White, Jeny
Author_Institution :
Motorola, Inc.
Keywords :
Current density; Electric resistance; Electromigration; Electrons; Flip chip; Microstructure; Optical microscopy; Soldering; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216383
